Abstract:

As semiconductor technologies continue to evolve, the integration of chiplets is the next frontier for enhancing performance, scalability and modularity in advanced systems. UCIe delivers a standard for establishing an open chiplet ecosystem. Since, reliability, availability and serviceability (RAS) are foundational for in-field deployment at scale, this talk provides an overview of the relevant UCIe features which can be leveraged at a system level to enhance the RAS capabilities of a product. The talk will begin by providing an overview of the UCIe framework, highlighting its role in facilitating seamless communication between heterogeneous chiplets. It will then cover the relevant UCIe features (for example, Lane repair for advanced packaging, width degrade for standard packaging, runtime Link monitoring etc.) that can be used to ensure high system reliability and availability. The talk will end with future looking work ongoing in the UCIe consortium relevant for this area.

Keynote

Corporate Vice President, General Manager, Data Center and AI Product Management, Intel Corporation

Dr. Zane A. Ball is a Corporate Vice President and General Manager of the Data Center and AI (DCAI) Product Management Group. DCAI Product Management is responsible for end-to-end stewardship of DCAI’s systems, SW, CPU, GPU, and custom product line through the entirety of the product lifecycle.  Prior to his product management role, Ball was CVP and GM of platform engineering and architecture for Intel’s data center business.  Ball has also served as Co-GM of Intel’s foundry effort as a VP in the Technology and Manufacturing group and VP of the Client Computing Group including roles as GM of the desktop client business and as GM of global customer engineering.

Ball has a bachelor’s degree, master’s degree, and Ph.D. in electrical engineering, all earned from Rice University.  He also holds six patents in high-speed electrical design.