{"id":277,"date":"2024-06-10T13:36:22","date_gmt":"2024-06-10T13:36:22","guid":{"rendered":"https:\/\/ieee-ras.conferences.computer.org\/2024\/?page_id=277"},"modified":"2024-06-10T13:37:57","modified_gmt":"2024-06-10T13:37:57","slug":"invited_talk_yervant_abstract","status":"publish","type":"page","link":"https:\/\/ieee-ras.conferences.computer.org\/2024\/invited_talk_yervant_abstract\/","title":{"rendered":"Invited_talk_Yervant_Abstract"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"277\" class=\"elementor elementor-277\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5da30be e-flex e-con-boxed e-con e-parent\" data-id=\"5da30be\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e2c9cd6 elementor-widget elementor-widget-text-editor\" data-id=\"e2c9cd6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Title: <\/strong>RAS Challenges &amp; Solution for Today\u2019s Chiplet-based Systems<\/p><p><strong>Speaker: Yervant Zorian<\/strong><\/p><p><strong>Abstract:<\/strong> <br \/>RAS plays a major role in multi-die chiplet-based systems, since individual chiplets, the interconnects between them, and the final integrated system must all be of known-good quality and reliability.\u00a0 So, RAS is a critical investment, if the overall design includes many different chiplets. With the growth in high-speed communication between chiplets, such as UCIe for logic-to-logic chiplets, and HBM for memory to logic chiplets, designers must be aware of test, monitoring and repair demands in all lifecycle phases by embedding corresponding resources for design-for-test, signal monitors and redundancy elements everywhere. Besides discussing this essential on-chip infrastructure, this presentation also covers silicon lifecycle management for chiplet-based systems, including the automated solutions needed to operate test and reliability sets, apply them, and perform data analytics on the results.\u00a0<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>Title: RAS Challenges &amp; Solution for Today\u2019s Chiplet-based Systems Speaker: Yervant Zorian Abstract: RAS plays a major role in multi-die chiplet-based systems, since individual chiplets, the interconnects between them, and the final integrated system must all be of known-good quality and reliability.\u00a0 So, RAS is a critical investment, if the overall design includes many different [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_canvas","meta":{"footnotes":""},"class_list":["post-277","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/pages\/277","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/comments?post=277"}],"version-history":[{"count":0,"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/pages\/277\/revisions"}],"wp:attachment":[{"href":"https:\/\/ieee-ras.conferences.computer.org\/2024\/wp-json\/wp\/v2\/media?parent=277"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}